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	Molecular dynamics simulation of subsurface damage mechanism during nanoscratching of single crystal silicon
	Dai, HF; Li, SB; Chen, GY
刊名	PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART J-JOURNAL OF ENGINEERING TRIBOLOGY
	2019
卷号	Vol.233 No.1页码:61-73
关键词	Molecular dynamics phase transformation dislocation subsurface damage scratch
ISSN号	1350-6501
URL标识	查看原文
公开日期	[db:dc_date_available]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/4738222
专题	湖南大学
作者单位	1.Guizhou Univ, Coll Mech Engn, Guiyang 550025, Guizhou, Peoples R China 2.Hunan Univ, State Key Lab Adv Design & Mfg Vehicle Body, Changsha, Hunan, Peoples R China
推荐引用方式 GB/T 7714	Dai, HF,Li, SB,Chen, GY. Molecular dynamics simulation of subsurface damage mechanism during nanoscratching of single crystal silicon[J]. PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART J-JOURNAL OF ENGINEERING TRIBOLOGY,2019,Vol.233 No.1:61-73.
APA	Dai, HF,Li, SB,&Chen, GY.(2019).Molecular dynamics simulation of subsurface damage mechanism during nanoscratching of single crystal silicon.PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART J-JOURNAL OF ENGINEERING TRIBOLOGY,Vol.233 No.1,61-73.
MLA	Dai, HF,et al."Molecular dynamics simulation of subsurface damage mechanism during nanoscratching of single crystal silicon".PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART J-JOURNAL OF ENGINEERING TRIBOLOGY Vol.233 No.1(2019):61-73.

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