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	A numerical study on subsurface quality and material removal during ultrasonic vibration assisted cutting of monocrystalline silicon by molecular dynamics simulation
	Dai, HF; Chen, JJ; Liu, GJ
刊名	MATERIALS RESEARCH EXPRESS
	2019
卷号	Vol.6 No.6
ISSN号	2053-1591
URL标识	查看原文
公开日期	[db:dc_date_available]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/4734063
专题	湖南大学
作者单位	1.Hunan Univ, State Key Lab Adv Design & Mfg Vehicle Body, Changsha 410082, Hunan, Peoples R China 2.Guizhou Univ, Coll Mech Engn, Guiyang 550025, Guizhou, Peoples R China 3.Ningde Normal Univ, Sch Informat & Elect Engn, Ningde 352100, Peoples R China 4.Hunan Univ Humanities Sci & Technol, Loudi 417000, Peoples R China
推荐引用方式 GB/T 7714	Dai, HF,Chen, JJ,Liu, GJ. A numerical study on subsurface quality and material removal during ultrasonic vibration assisted cutting of monocrystalline silicon by molecular dynamics simulation[J]. MATERIALS RESEARCH EXPRESS,2019,Vol.6 No.6.
APA	Dai, HF,Chen, JJ,&Liu, GJ.(2019).A numerical study on subsurface quality and material removal during ultrasonic vibration assisted cutting of monocrystalline silicon by molecular dynamics simulation.MATERIALS RESEARCH EXPRESS,Vol.6 No.6.
MLA	Dai, HF,et al."A numerical study on subsurface quality and material removal during ultrasonic vibration assisted cutting of monocrystalline silicon by molecular dynamics simulation".MATERIALS RESEARCH EXPRESS Vol.6 No.6(2019).

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