Multifunctional substrate polishing and burnishing device for polishing hard material e.g. silicon wafer, has spindle polishing unit and spindle burnishing unit which are dragged by traction rope and are in mutual counterweight. | |
KANG R ZHU X DONG Z FENG G GUO D | |
2013 | |
公开日期 | 2013-07-25 |
URL标识 | 查看原文 |
申请日期 | 2012-01-19 |
内容类型 | 专利 |
URI标识 | http://www.corc.org.cn/handle/1471x/4638091 |
专题 | 大连理工大学 |
作者单位 | UNIV DALIAN TECHNOLOGY KANG R ZHU X DONG Z FENG G GUO D UNIV DALIAN TECHNOLOGY SCHOOL MECHANICAL ENG (UYDA-C |
推荐引用方式 GB/T 7714 | KANG R ZHU X DONG Z FENG G GUO D. Multifunctional substrate polishing and burnishing device for polishing hard material e.g. silicon wafer, has spindle polishing unit and spindle burnishing unit which are dragged by traction rope and are in mutual counterweight.. 2013-01-01. |
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