Method of forming multi-layer metal mobile microstructure on metal base involves treating pattern-containing substrate using nickel electroforming solution comprising nickel sulfamate, nickel chloride, and boric acid. | |
WANG A DU L LI C | |
2013 | |
公开日期 | 2013-05-15 |
URL标识 | 查看原文 |
申请日期 | 2013-01-14 |
内容类型 | 专利 |
URI标识 | http://www.corc.org.cn/handle/1471x/4637458 |
专题 | 大连理工大学 |
作者单位 | UNIV DALIAN TECHNOLOGY (UYDA-C |
推荐引用方式 GB/T 7714 | WANG A DU L LI C. Method of forming multi-layer metal mobile microstructure on metal base involves treating pattern-containing substrate using nickel electroforming solution comprising nickel sulfamate, nickel chloride, and boric acid.. 2013-01-01. |
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