| A model for wafer rotational nanogrinding of soft-brittle CdZnTe wafers | |
| Zhou, Hongxiu; Qiu, Shuo; Wang, Chunmei | |
| 刊名 | INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY
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| 2013 | |
| 卷号 | 69页码:2621-2627 |
| 关键词 | Nanogrinding Undeformed chip thickness Brittle-ductile transition CdZnTe Surface roughness |
| ISSN号 | 0268-3768 |
| URL标识 | 查看原文 |
| 内容类型 | 期刊论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/4542173 |
| 专题 | 大连理工大学 |
| 作者单位 | Dalian Univ Technol, Sch Energy & Power Engn, Dalian 116024, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Zhou, Hongxiu,Qiu, Shuo,Wang, Chunmei. A model for wafer rotational nanogrinding of soft-brittle CdZnTe wafers[J]. INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY,2013,69:2621-2627. |
| APA | Zhou, Hongxiu,Qiu, Shuo,&Wang, Chunmei.(2013).A model for wafer rotational nanogrinding of soft-brittle CdZnTe wafers.INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY,69,2621-2627. |
| MLA | Zhou, Hongxiu,et al."A model for wafer rotational nanogrinding of soft-brittle CdZnTe wafers".INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY 69(2013):2621-2627. |
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