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	Quality detection of wire bonding using ultrasonic electrical signal of piezoelectric transducer
	Feng, Wuwei; Meng, Qingfeng; Xie, Youbo
刊名	Hsi-An Chiao Tung Ta Hsueh/Journal of Xi'an Jiaotong University
	2010
卷号	44期号:[db:dc_citation_issue]页码:64-68
关键词	Bonding quality Electrical signal Feature extraction methods Information carriers Principal component analysis method Transient ultrasonic Ultrasonic generator Wire bonding
ISSN号	0253-987X
DOI	[db:dc_identifier_doi]
URL标识	查看原文
WOS记录号	[DB:DC_IDENTIFIER_WOSID]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/4502168
专题	西安交通大学
推荐引用方式 GB/T 7714	Feng, Wuwei,Meng, Qingfeng,Xie, Youbo. Quality detection of wire bonding using ultrasonic electrical signal of piezoelectric transducer[J]. Hsi-An Chiao Tung Ta Hsueh/Journal of Xi'an Jiaotong University,2010,44([db:dc_citation_issue]):64-68.
APA	Feng, Wuwei,Meng, Qingfeng,&Xie, Youbo.(2010).Quality detection of wire bonding using ultrasonic electrical signal of piezoelectric transducer.Hsi-An Chiao Tung Ta Hsueh/Journal of Xi'an Jiaotong University,44([db:dc_citation_issue]),64-68.
MLA	Feng, Wuwei,et al."Quality detection of wire bonding using ultrasonic electrical signal of piezoelectric transducer".Hsi-An Chiao Tung Ta Hsueh/Journal of Xi'an Jiaotong University 44.[db:dc_citation_issue](2010):64-68.

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