Glue composition comprises bisphenol A epoxy resin, nitrile rubber-modified bisphenol A epoxy resin, polyurethane modified bisphenol A epoxy resin, silane coupling agent, polyetheramine and phenolic aldehyde modified amine. | |
CHEN Z HE G HE M REN Y | |
2015 | |
公开日期 | 2015-06-24 |
URL标识 | 查看原文 |
申请日期 | 2015-04-10 |
内容类型 | 专利 |
URI标识 | http://www.corc.org.cn/handle/1471x/4413091 |
专题 | 大连理工大学 |
作者单位 | UNIV DALIAN TECHNOLOGY (UYDA-C |
推荐引用方式 GB/T 7714 | CHEN Z HE G HE M REN Y. Glue composition comprises bisphenol A epoxy resin, nitrile rubber-modified bisphenol A epoxy resin, polyurethane modified bisphenol A epoxy resin, silane coupling agent, polyetheramine and phenolic aldehyde modified amine.. 2015-01-01. |
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