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	On the pressure effect in energetic deposition of Cu thin films by modulated pulsed power magnetron sputtering: A global plasma model and experiments
	Zheng, B. C.; Meng, D.; Che, H. L.; Lei, M. K.
刊名	JOURNAL OF APPLIED PHYSICS
	2015
卷号	117页码:-
ISSN号	0021-8979
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/4406535
专题	大连理工大学
作者单位	Dalian Univ Technol, Sch Mat Sci & Engn, Surface Engn Lab, Dalian 116024, Peoples R China.
推荐引用方式 GB/T 7714	Zheng, B. C.,Meng, D.,Che, H. L.,et al. On the pressure effect in energetic deposition of Cu thin films by modulated pulsed power magnetron sputtering: A global plasma model and experiments[J]. JOURNAL OF APPLIED PHYSICS,2015,117:-.
APA	Zheng, B. C.,Meng, D.,Che, H. L.,&Lei, M. K..(2015).On the pressure effect in energetic deposition of Cu thin films by modulated pulsed power magnetron sputtering: A global plasma model and experiments.JOURNAL OF APPLIED PHYSICS,117,-.
MLA	Zheng, B. C.,et al."On the pressure effect in energetic deposition of Cu thin films by modulated pulsed power magnetron sputtering: A global plasma model and experiments".JOURNAL OF APPLIED PHYSICS 117(2015):-.

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