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	Impingement Cooling Performance Analysis and Improvement of Synthetic Jets for Electronic Devices
	Liu, Zhuo; Yu, Qinghua; Mei, Ziyue; Xie, Danmei
刊名	JOURNAL OF THERMOPHYSICS AND HEAT TRANSFER
	2019
卷号	33期号:3
ISSN号	0887-8722
DOI	10.2514/1.T5723
URL标识	查看原文
收录类别	SCIE
语种	英语
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/4218213
专题	武汉大学
推荐引用方式 GB/T 7714	Liu, Zhuo,Yu, Qinghua,Mei, Ziyue,et al. Impingement Cooling Performance Analysis and Improvement of Synthetic Jets for Electronic Devices[J]. JOURNAL OF THERMOPHYSICS AND HEAT TRANSFER,2019,33(3).
APA	Liu, Zhuo,Yu, Qinghua,Mei, Ziyue,&Xie, Danmei.(2019).Impingement Cooling Performance Analysis and Improvement of Synthetic Jets for Electronic Devices.JOURNAL OF THERMOPHYSICS AND HEAT TRANSFER,33(3).
MLA	Liu, Zhuo,et al."Impingement Cooling Performance Analysis and Improvement of Synthetic Jets for Electronic Devices".JOURNAL OF THERMOPHYSICS AND HEAT TRANSFER 33.3(2019).

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