Thermal stress behavior of diffusion-bonded SiC/6061Al laminates during thermal cycling

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	Thermal stress behavior of diffusion-bonded SiC/6061Al laminates during thermal cycling
	H. Li ; J. B. Li ; Z. G. Wang ; C. H. Jiang ; D. Z. Wang
刊名	Journal of Materials Science & Technology
	1999
卷号	15 期号:2 页码:117-120
关键词	residual-stress thin-films near-interface temperature curvature composite substrate formula layer
ISSN号	1005-0302
中文摘要	The thermal stress behavior of bonded SiC/6061AL laminates during thermal cycling and the stress relaxation at elevated temperature (205 degrees C) were investigated by means of X-ray diffraction. It was found that the elastic and elastoplastic deformation in the 6061Al layer took place during thermal cycling, and the same closed stress temperature loop was formed in the second cycling for the aged and low temperature treated specimen. Meanwhile, it was demonstrated that the compressive stress relaxed in 6061Al layer at 205 degrees C within the range of 0.5 similar to 16 h, and which was nearly unchanged with further prolongation of time.
原文出处	://WOS:000079552000003
公开日期	2012-04-14
内容类型	期刊论文
源URL	[http://ir.imr.ac.cn/handle/321006/37400]
专题	金属研究所_中国科学院金属研究所
推荐引用方式 GB/T 7714	H. Li,J. B. Li,Z. G. Wang,et al. Thermal stress behavior of diffusion-bonded SiC/6061Al laminates during thermal cycling[J]. Journal of Materials Science & Technology,1999,15(2):117-120.
APA	H. Li,J. B. Li,Z. G. Wang,C. H. Jiang,&D. Z. Wang.(1999).Thermal stress behavior of diffusion-bonded SiC/6061Al laminates during thermal cycling.Journal of Materials Science & Technology,15(2),117-120.
MLA	H. Li,et al."Thermal stress behavior of diffusion-bonded SiC/6061Al laminates during thermal cycling".Journal of Materials Science & Technology 15.2(1999):117-120.