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Cyclic deformation behavior of a copper tricrystal and bicrystal
W. P. Jia ; S. X. Li ; Z. G. Wang
刊名Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing
1999
卷号263期号:1页码:64-74
关键词cyclic deformation copper tricrystal single-crystals double slip dislocation-structure aluminum tricrystals boundary stress
ISSN号0921-5093
中文摘要Cyclic deformation was applied to a copper tricrystal (TC) as well as a bicrystal (BC) at constant axial plastic strain amplitude in the range of 1 x 10(-4) less than or equal to epsilon(pl) less than or equal to 4 x 10(-3). The initial cyclic hardening of TC was found to be similar to that of BC at low strain amplitudes. The cyclic hardening of TC is higher than that of BC at higher epsilon(pl) and the distinction becomes pronounced with epsilon(pl) increasing. The cyclic stress-strain (CSS) curve of TC is obviously higher than that of BC. No matter for TC and BC specimens, sigma(s) increases slowly with increasing epsilon(pl) and the difference between them is almost independent of epsilon(pl) when epsilon(pl) < 1.5 x 10(-3), sigma(s) of TC and BC as well as the difference between them increase obviously after epsilon(pl) > 1.5 x 10(-3). Both curves show almost no plateau. The above mechanical behaviors are in accord with surface morphologies and simple analysis. Two effects of the grain boundary triple junction (TJ) on slip have been found: one is retardation to the primary slip at lower strain amplitudes, the other is the activation of multiple slip systems due to the internal stresses caused by the strain incompatibilities. Deformation bands appeared near grain boundary for BC at higher strain amplitudes while these did not occur for TC at the same strain amplitude. Microcracks nucleated near TJ for epsilon(pl) greater than 0.7 x 10(-4). (C) 1999 Elsevier Science S.A. All rights reserved.
原文出处://WOS:000079705000008
公开日期2012-04-14
内容类型期刊论文
源URL[http://ir.imr.ac.cn/handle/321006/37380]  
专题金属研究所_中国科学院金属研究所
推荐引用方式
GB/T 7714
W. P. Jia,S. X. Li,Z. G. Wang. Cyclic deformation behavior of a copper tricrystal and bicrystal[J]. Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing,1999,263(1):64-74.
APA W. P. Jia,S. X. Li,&Z. G. Wang.(1999).Cyclic deformation behavior of a copper tricrystal and bicrystal.Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing,263(1),64-74.
MLA W. P. Jia,et al."Cyclic deformation behavior of a copper tricrystal and bicrystal".Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing 263.1(1999):64-74.
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