Cu-Zr-Ti ternary bulk metallic glasses correlated with (L -> Cu8Zr3+Cu10Zr7) univariant eutectic reaction | |
C. L. Dai ; J. W. Deng ; Z. X. Zhang ; J. Xu | |
刊名 | Journal of Materials Research |
2008 | |
卷号 | 23期号:5页码:1249-1257 |
关键词 | mechanical-properties thermal-stability room-temperature forming ability system alloys plasticity ductility diameter |
ISSN号 | 0884-2914 |
中文摘要 | Starting from CU60Zr30Ti10, the compositional dependence of bulk metallic glass (BMG) formation was revisited in the Cu-Zr-Ti ternary system. It was revealed that the optimal BMG-forming composition is located at CU60Zr33Ti7, for which a monolithic BMG rod 4 mm in diameter can be fabricated using copper mold casting. This composition is along, although slightly off, the univariant eutectic groove for the reaction (L --> Cu8Zr3 + Cu10Zr7). With respect to the corresponding Cu-Zr binary alloys, Ti has a significant effect on further stabilizing the liquid, thus increasing the glass-forming ability. For the Cu60Zr40-yTiy (3 <= y <= 10) series BMGs, the glass transition temperature T. decreased with increasing Ti content, at a rate of about 2.8 K/at.%. Among these BMGs, significant compositional dependence of compressive plasticity is not observed, irrespective of the T. change. CU60Zr33Ti7 glass exhibits maximum fracture strength around 2160 MPa. |
原文出处 | |
公开日期 | 2012-04-13 |
内容类型 | 期刊论文 |
源URL | [http://210.72.142.130/handle/321006/32706] |
专题 | 金属研究所_中国科学院金属研究所 |
推荐引用方式 GB/T 7714 | C. L. Dai,J. W. Deng,Z. X. Zhang,et al. Cu-Zr-Ti ternary bulk metallic glasses correlated with (L -> Cu8Zr3+Cu10Zr7) univariant eutectic reaction[J]. Journal of Materials Research,2008,23(5):1249-1257. |
APA | C. L. Dai,J. W. Deng,Z. X. Zhang,&J. Xu.(2008).Cu-Zr-Ti ternary bulk metallic glasses correlated with (L -> Cu8Zr3+Cu10Zr7) univariant eutectic reaction.Journal of Materials Research,23(5),1249-1257. |
MLA | C. L. Dai,et al."Cu-Zr-Ti ternary bulk metallic glasses correlated with (L -> Cu8Zr3+Cu10Zr7) univariant eutectic reaction".Journal of Materials Research 23.5(2008):1249-1257. |
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