Electroless Ni-P coating on W-Cu composite via three different activation processes

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	Electroless Ni-P coating on W-Cu composite via three different activation processes
	L. Hao ; J. Wei ; F. X. Gan
刊名	Surface Engineering
	2009
卷号	25 期号:5 页码:372-375
关键词	Electroless Ni-P coating W-Cu composite XRD SEM sintering behavior thermal-conductivity nickel alloys metallization deposition powder fabrication reduction particles
ISSN号	0267-0844
中文摘要	To obtain qualified electroless Ni-P coating on W-Cu composite, the influences of three different activation processes, chemical activation, chemical activation and strike nickel plating, and anodic activation and strike nickel plating, on the adhesion of electroless Ni-P coating to W-Cu composite have been studied in this paper. The adhesion between the Ni-P coating and the W Cu composite has been estimated by scratch, file and bend tests. The results indicate that the samples, pretreated by anodic activation and strike nickel plating, have the qualified adhesion. The samples that pretreated by chemical activation and chemical activation and strike nickel plating do not have the qualified adhesion. SEM shows that the surface morphology of Ni-P coating is smooth, no hemispherical clusters appeared and XRD indicates that it has an amorphous structure.
原文出处	://WOS:000266528100006
公开日期	2012-04-13
内容类型	期刊论文
源URL	[http://ir.imr.ac.cn/handle/321006/31954]
专题	金属研究所_中国科学院金属研究所
推荐引用方式 GB/T 7714	L. Hao,J. Wei,F. X. Gan. Electroless Ni-P coating on W-Cu composite via three different activation processes[J]. Surface Engineering,2009,25(5):372-375.
APA	L. Hao,J. Wei,&F. X. Gan.(2009).Electroless Ni-P coating on W-Cu composite via three different activation processes.Surface Engineering,25(5),372-375.
MLA	L. Hao,et al."Electroless Ni-P coating on W-Cu composite via three different activation processes".Surface Engineering 25.5(2009):372-375.