Fast Spreading of Liquid SnPb Solder on Gold-coated Copper Wheel Pattern

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	Fast Spreading of Liquid SnPb Solder on Gold-coated Copper Wheel Pattern
	W. Liu ; L. Zhang ; K. J. Hsia ; J. K. Shang
刊名	Journal of Materials Science & Technology
	2010
卷号	26 期号:12 页码:1143-1147
关键词	Wetting Reactive wetting Spreading Solder Thin film pattern Liquid film morphological wetting transitions structured surfaces eutectic snpb films
ISSN号	1005-0302
中文摘要	The reactive Sn63Pb37 spreading on patterned film structures was examined in a reducing atmosphere (H(2) 5%+Ar 95%). Liquid solder spreading was observed to follow the wheel pattern made of Au/Cu thin film. At the center, a liquid cap was formed around the hub by viscous spreading of the liquid front. Ahead of the main viscous flow front, a liquid film was found to be extended on thin Au-Cu lines at a fast rate to a great distance by rapid Sn-Au chemical reaction.
原文出处	://WOS:000286153900015
公开日期	2012-04-13
内容类型	期刊论文
源URL	[http://210.72.142.130/handle/321006/31309]
专题	金属研究所_中国科学院金属研究所
推荐引用方式 GB/T 7714	W. Liu,L. Zhang,K. J. Hsia,et al. Fast Spreading of Liquid SnPb Solder on Gold-coated Copper Wheel Pattern[J]. Journal of Materials Science & Technology,2010,26(12):1143-1147.
APA	W. Liu,L. Zhang,K. J. Hsia,&J. K. Shang.(2010).Fast Spreading of Liquid SnPb Solder on Gold-coated Copper Wheel Pattern.Journal of Materials Science & Technology,26(12),1143-1147.
MLA	W. Liu,et al."Fast Spreading of Liquid SnPb Solder on Gold-coated Copper Wheel Pattern".Journal of Materials Science & Technology 26.12(2010):1143-1147.