Mechanical properties of thin films of hydrogenated silicon and their relationship with microstructure

	Mechanical properties of thin films of hydrogenated silicon and their relationship with microstructure
	Wang, Q ; Hu, R ; Ding, JN ; Jiang, LY
刊名	APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING
	2011
卷号	105 期号:1 页码:153-159
关键词	SPRINGER
ISSN号	0947-8396
学科主题	Materials Science, Multidisciplinary; Physics, Applied
语种	英语
公开日期	2012-04-12
内容类型	期刊论文
源URL	[http://ir.sim.ac.cn/handle/331004/106894]
专题	上海微系统与信息技术研究所_微系统技术_期刊论文
推荐引用方式 GB/T 7714	Wang, Q,Hu, R,Ding, JN,et al. Mechanical properties of thin films of hydrogenated silicon and their relationship with microstructure[J]. APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING,2011,105(1):153-159.
APA	Wang, Q,Hu, R,Ding, JN,&Jiang, LY.(2011).Mechanical properties of thin films of hydrogenated silicon and their relationship with microstructure.APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING,105(1),153-159.
MLA	Wang, Q,et al."Mechanical properties of thin films of hydrogenated silicon and their relationship with microstructure".APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING 105.1(2011):153-159.