Effect of substrate type on the evolution of residual stress during and after curing COB packages

	Effect of substrate type on the evolution of residual stress during and after curing COB packages
	Sun, ZG ; Huang, WD ; Luo, L
刊名	ACTA METALLURGICA SINICA
	2001
卷号	37 期号:12 页码:1281-1284
ISSN号	0412-1961
通讯作者	Luo, L, Chinese Acad Sci, Shanghai Inst Met, Shanghai 200051, Peoples R China
学科主题	Metallurgy & Metallurgical Engineering
收录类别	SCI
语种	中文
公开日期	2012-03-24
内容类型	期刊论文
源URL	[http://ir.sim.ac.cn/handle/331004/95717]
专题	上海微系统与信息技术研究所_功能材料与器件_期刊论文
推荐引用方式 GB/T 7714	Sun, ZG,Huang, WD,Luo, L. Effect of substrate type on the evolution of residual stress during and after curing COB packages[J]. ACTA METALLURGICA SINICA,2001,37(12):1281-1284.
APA	Sun, ZG,Huang, WD,&Luo, L.(2001).Effect of substrate type on the evolution of residual stress during and after curing COB packages.ACTA METALLURGICA SINICA,37(12),1281-1284.
MLA	Sun, ZG,et al."Effect of substrate type on the evolution of residual stress during and after curing COB packages".ACTA METALLURGICA SINICA 37.12(2001):1281-1284.