The surface energy and nano-adhesion behavior of some micro-component material in MEMS

	The surface energy and nano-adhesion behavior of some micro-component material in MEMS
	Xue, W ; Zheng, BR ; Zhang, M ; Xie, GX ; Wang, Q
刊名	ACTA PHYSICA SINICA
	2009
卷号	58 期号:4 页码:2518-2522
关键词	THIN-FILM FORCE DEFORMATION ROUGHNESS
ISSN号	1000-3290
通讯作者	Xie, GX, Tsinghua Univ, State Key Lab Tribol, Beijing 100084, Peoples R China
学科主题	Physics ; Multidisciplinary
收录类别	SCI
语种	中文
公开日期	2012-03-24
内容类型	期刊论文
源URL	[http://ir.sim.ac.cn/handle/331004/94829]
专题	上海微系统与信息技术研究所_微系统技术_期刊论文
推荐引用方式 GB/T 7714	Xue, W,Zheng, BR,Zhang, M,et al. The surface energy and nano-adhesion behavior of some micro-component material in MEMS[J]. ACTA PHYSICA SINICA,2009,58(4):2518-2522.
APA	Xue, W,Zheng, BR,Zhang, M,Xie, GX,&Wang, Q.(2009).The surface energy and nano-adhesion behavior of some micro-component material in MEMS.ACTA PHYSICA SINICA,58(4),2518-2522.
MLA	Xue, W,et al."The surface energy and nano-adhesion behavior of some micro-component material in MEMS".ACTA PHYSICA SINICA 58.4(2009):2518-2522.