| Effects of Van der Waals Bonding on the Compressive Mechanical Behavior of Bulk Bi2Te3: A Molecular Dynamics Study | |
| Huang, Ben; Yang, Xuqiu*; Liu, Lisheng; Zhai, Pengcheng | |
| 刊名 | Journal of Electronic Materials
 |
| 2015 | |
| 卷号 | 44期号:6页码:1668-1673 |
| 关键词 | Bi2Te3 Van der Waals bonding compression properties molecular dynamics |
| ISSN号 | 0361-5235 |
| DOI | 10.1007/s11664-014-3510-x |
| 会议名称 | International Conference on Thermoelectrics (ICT) |
| URL标识 | 查看原文 |
| 会议地点 | Nashville, TN |
| 会议日期 | JUL 06-10, 2014 |
| WOS记录号 | WOS:000353813700045;EI:20144900297260 |
| 内容类型 | 期刊论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/3370528 |
| 专题 | 武汉理工大学 |
| 作者单位 | 1.[Huang, Ben 2.Yang, Xuqiu 3.Zhai, Pengcheng 4.Liu, Lisheng] Wuhan Univ Technol, Dept Engn Struct & Mech, Wuhan 430070, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Huang, Ben,Yang, Xuqiu*,Liu, Lisheng,et al. Effects of Van der Waals Bonding on the Compressive Mechanical Behavior of Bulk Bi2Te3: A Molecular Dynamics Study[J]. Journal of Electronic Materials,2015,44(6):1668-1673. |
| APA | Huang, Ben,Yang, Xuqiu*,Liu, Lisheng,&Zhai, Pengcheng.(2015).Effects of Van der Waals Bonding on the Compressive Mechanical Behavior of Bulk Bi2Te3: A Molecular Dynamics Study.Journal of Electronic Materials,44(6),1668-1673. |
| MLA | Huang, Ben,et al."Effects of Van der Waals Bonding on the Compressive Mechanical Behavior of Bulk Bi2Te3: A Molecular Dynamics Study".Journal of Electronic Materials 44.6(2015):1668-1673. |
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