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	Using CO2-laser bugle for ultrasonic bonding of thermoplastic microfluidic devices
	Liang, Chao; Meng, Fanjian; Li, Jingmin; Liu, Chong
刊名	JOURNAL OF MATERIALS PROCESSING TECHNOLOGY
	2018
卷号	252页码:25-33
关键词	Ultrasonic bonding Energy director Laser bulge Microfluidic devices
ISSN号	0924-0136
URL标识	查看原文
WOS记录号	[DB:DC_IDENTIFIER_WOSID]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/3276983
专题	大连理工大学
作者单位	1.Dalian Univ Technol, Key Lab Micro Nano Technol & Syst Liaoning Prov, Dalian, Peoples R China. 2.Dalian Univ Technol, Key Lab Micro Nano Technol & Syst Liaoning Prov, Dalian, Peoples R China. 3.Dalian Univ Technol, Key Lab Precis & Nontradit Machining Technol, Minist Educ, Dalian, Peoples R China.
推荐引用方式 GB/T 7714	Liang, Chao,Meng, Fanjian,Li, Jingmin,et al. Using CO2-laser bugle for ultrasonic bonding of thermoplastic microfluidic devices[J]. JOURNAL OF MATERIALS PROCESSING TECHNOLOGY,2018,252:25-33.
APA	Liang, Chao,Meng, Fanjian,Li, Jingmin,&Liu, Chong.(2018).Using CO2-laser bugle for ultrasonic bonding of thermoplastic microfluidic devices.JOURNAL OF MATERIALS PROCESSING TECHNOLOGY,252,25-33.
MLA	Liang, Chao,et al."Using CO2-laser bugle for ultrasonic bonding of thermoplastic microfluidic devices".JOURNAL OF MATERIALS PROCESSING TECHNOLOGY 252(2018):25-33.

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