| Solidification microstructure evolution and its corresponding mechanism of metastable immiscible Cu80Fe20 alloy with different cooling conditions | |
| Liu, Shichao; Jie, Jinchuan; Guo, Zhongkai; Yin, Guomao; Wang, Tongmin; Li, Tingju | |
| 刊名 | JOURNAL OF ALLOYS AND COMPOUNDS
 |
| 2018 | |
| 卷号 | 742页码:99-106 |
| 关键词 | Metastable immiscible Cu-Fe alloy Cooling rate Constitutional undercooling Microstructure evolution |
| ISSN号 | 0925-8388 |
| URL标识 | 查看原文 |
| WOS记录号 | [DB:DC_IDENTIFIER_WOSID] |
| 内容类型 | 期刊论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/3273217 |
| 专题 | 大连理工大学 |
| 作者单位 | Dalian Univ Technol, Sch Mat Sci & Engn, Lab Solidificat Control & Digital Preparat Techno, Dalian 116024, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Liu, Shichao,Jie, Jinchuan,Guo, Zhongkai,et al. Solidification microstructure evolution and its corresponding mechanism of metastable immiscible Cu80Fe20 alloy with different cooling conditions[J]. JOURNAL OF ALLOYS AND COMPOUNDS,2018,742:99-106. |
| APA | Liu, Shichao,Jie, Jinchuan,Guo, Zhongkai,Yin, Guomao,Wang, Tongmin,&Li, Tingju.(2018).Solidification microstructure evolution and its corresponding mechanism of metastable immiscible Cu80Fe20 alloy with different cooling conditions.JOURNAL OF ALLOYS AND COMPOUNDS,742,99-106. |
| MLA | Liu, Shichao,et al."Solidification microstructure evolution and its corresponding mechanism of metastable immiscible Cu80Fe20 alloy with different cooling conditions".JOURNAL OF ALLOYS AND COMPOUNDS 742(2018):99-106. |
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