| Enhancing the Thermal Conductivity of Silicone Composites by Increasing Crosslink Degree | |
| Li, Jie; Zhang, Xinfeng; Yuen, Matthew Ming-Fai; Zhang, Kai; Liu, Lisa; Ku, Cheng Sheng | |
| 2014 | |
| 关键词 | crosslink degree silicone thermal coductive materials transparency thermal conductivity |
| 期号 | [db:dc_citation_issue] |
| DOI | [db:dc_identifier_doi] |
| 页码 | 329-333 |
| 会议录 | 2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)
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| URL标识 | 查看原文 |
| ISSN号 | 9781479947072 |
| WOS记录号 | [DB:DC_IDENTIFIER_WOSID] |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/3271392 |
| 专题 | 西安交通大学 |
| 推荐引用方式 GB/T 7714 | Li, Jie,Zhang, Xinfeng,Yuen, Matthew Ming-Fai,et al. Enhancing the Thermal Conductivity of Silicone Composites by Increasing Crosslink Degree[C]. 见:. |
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