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	Energetics of point defect interacting with bi-crystal Sigma 3 copper grain boundaries
	Yu, Wenshan; Shen, Shengping; Liu, Qunfeng
刊名	COMPUTATIONAL MATERIALS SCIENCE
	2016
卷号	118期号:[db:dc_citation_issue]页码:47-55
关键词	Grain boundaries Formation energy Point defect Sink strength
ISSN号	0927-0256
DOI	[db:dc_identifier_doi]
URL标识	查看原文
WOS记录号	[DB:DC_IDENTIFIER_WOSID]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/3230209
专题	西安交通大学
推荐引用方式 GB/T 7714	Yu, Wenshan,Shen, Shengping,Liu, Qunfeng. Energetics of point defect interacting with bi-crystal Sigma 3 copper grain boundaries[J]. COMPUTATIONAL MATERIALS SCIENCE,2016,118([db:dc_citation_issue]):47-55.
APA	Yu, Wenshan,Shen, Shengping,&Liu, Qunfeng.(2016).Energetics of point defect interacting with bi-crystal Sigma 3 copper grain boundaries.COMPUTATIONAL MATERIALS SCIENCE,118([db:dc_citation_issue]),47-55.
MLA	Yu, Wenshan,et al."Energetics of point defect interacting with bi-crystal Sigma 3 copper grain boundaries".COMPUTATIONAL MATERIALS SCIENCE 118.[db:dc_citation_issue](2016):47-55.

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