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	Improving interfacial adhesion between copper foil and resin using amino acid in printed circuit board industry
	Luo, Li[1]; Zhang, Shengtao[1]; Qiang, Yujie[1]; Bozdag, Ismail[2]; Chen, Shijin[3]; Tang, Mingxing[1]; Gao, Jingyao[4]; Qin, Zhongjian[1]
	2018
卷号	32页码:1452-1470
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/2979339
专题	重庆大学
推荐引用方式 GB/T 7714	Luo, Li[1],Zhang, Shengtao[1],Qiang, Yujie[1],et al. Improving interfacial adhesion between copper foil and resin using amino acid in printed circuit board industry[J],2018,32:1452-1470.
APA	Luo, Li[1].,Zhang, Shengtao[1].,Qiang, Yujie[1].,Bozdag, Ismail[2].,Chen, Shijin[3].,...&Qin, Zhongjian[1].(2018).Improving interfacial adhesion between copper foil and resin using amino acid in printed circuit board industry.,32,1452-1470.
MLA	Luo, Li[1],et al."Improving interfacial adhesion between copper foil and resin using amino acid in printed circuit board industry".32(2018):1452-1470.

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