4,6-Dimethyl-2-mercaptopyrimidine as a potential leveler for microvia filling with electroplating copper | |
Tang, Mingxing[1]; Zhang, Shengtao[1]; Qiang, Yujie[1]; Chen, Shijin[2]; Luo, Li[1]; Gao, Jingyao[3]; Feng, Li[1]; Qin, Zhongjian[1] | |
2017 | |
卷号 | 7页码:40342-40353 |
URL标识 | 查看原文 |
内容类型 | 期刊论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/2976579 |
专题 | 重庆大学 |
推荐引用方式 GB/T 7714 | Tang, Mingxing[1],Zhang, Shengtao[1],Qiang, Yujie[1],et al. 4,6-Dimethyl-2-mercaptopyrimidine as a potential leveler for microvia filling with electroplating copper[J],2017,7:40342-40353. |
APA | Tang, Mingxing[1].,Zhang, Shengtao[1].,Qiang, Yujie[1].,Chen, Shijin[2].,Luo, Li[1].,...&Qin, Zhongjian[1].(2017).4,6-Dimethyl-2-mercaptopyrimidine as a potential leveler for microvia filling with electroplating copper.,7,40342-40353. |
MLA | Tang, Mingxing[1],et al."4,6-Dimethyl-2-mercaptopyrimidine as a potential leveler for microvia filling with electroplating copper".7(2017):40342-40353. |
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