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	Voltage Suppression in Wire-Bond-Based Multichip Phase-Leg SiC MOSFET Module Using Adjacent Decoupling Concept
	Ren, Yu; Yang, Xu; Zhang, Fan; Wang, Laili; Wang, Kangping; Chen, Wenjie; Zeng, Xiangjun; Pei, Yunqing
刊名	IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS
	2017
卷号	64页码:8235-8246
关键词	silicon carbide (SiC) metal-oxide-semiconductor field-effect transistor (MOSFET) module packaging Commutation loop inductance voltage overshoot split decoupling capacitors
ISSN号	0278-0046
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/2950609
专题	西安交通大学
推荐引用方式 GB/T 7714	Ren, Yu,Yang, Xu,Zhang, Fan,et al. Voltage Suppression in Wire-Bond-Based Multichip Phase-Leg SiC MOSFET Module Using Adjacent Decoupling Concept[J]. IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS,2017,64:8235-8246.
APA	Ren, Yu.,Yang, Xu.,Zhang, Fan.,Wang, Laili.,Wang, Kangping.,...&Pei, Yunqing.(2017).Voltage Suppression in Wire-Bond-Based Multichip Phase-Leg SiC MOSFET Module Using Adjacent Decoupling Concept.IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS,64,8235-8246.
MLA	Ren, Yu,et al."Voltage Suppression in Wire-Bond-Based Multichip Phase-Leg SiC MOSFET Module Using Adjacent Decoupling Concept".IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS 64(2017):8235-8246.

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