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	Review on Brazing of High Volume Faction SiCp/Al Composites for Electronic Packaging Applications
	Zhang, Xiangzhao; Zhao, Santuan; Liu, Guiwu; Xu, Ziwei; Shao, Haicheng; Qiao, Guanjun
刊名	Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering
	2017
卷号	46页码:2812-2819
关键词	Electronic packaging applications Electronic packaging material Interfacial behaviors Joint microstructures Operating temperature Physical and mechanical properties SiCp/Al composites Surface metallization
ISSN号	1002-185X
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/2924544
专题	西安交通大学
推荐引用方式 GB/T 7714	Zhang, Xiangzhao,Zhao, Santuan,Liu, Guiwu,et al. Review on Brazing of High Volume Faction SiCp/Al Composites for Electronic Packaging Applications[J]. Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering,2017,46:2812-2819.
APA	Zhang, Xiangzhao,Zhao, Santuan,Liu, Guiwu,Xu, Ziwei,Shao, Haicheng,&Qiao, Guanjun.(2017).Review on Brazing of High Volume Faction SiCp/Al Composites for Electronic Packaging Applications.Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering,46,2812-2819.
MLA	Zhang, Xiangzhao,et al."Review on Brazing of High Volume Faction SiCp/Al Composites for Electronic Packaging Applications".Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering 46(2017):2812-2819.

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