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	Calculation model for thermal-caused passive intermodulation product of microstrip lines
	He, Yun; Wang, Qi; Hu, Tiancun; Wang, Xinbo; Li, Jun; Cui, Wanzhao; Liu, Chunliang
刊名	Xi'an Dianzi Keji Daxue Xuebao/Journal of Xidian University
	2017
卷号	44页码:120-126
关键词	Beat frequency Calculation models Dielectric substrates Heat conduction equations One dimension Passive intermodulation Thermal parameters Third order intermodulation products
ISSN号	1001-2400
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/2924390
专题	西安交通大学
推荐引用方式 GB/T 7714	He, Yun,Wang, Qi,Hu, Tiancun,et al. Calculation model for thermal-caused passive intermodulation product of microstrip lines[J]. Xi'an Dianzi Keji Daxue Xuebao/Journal of Xidian University,2017,44:120-126.
APA	He, Yun.,Wang, Qi.,Hu, Tiancun.,Wang, Xinbo.,Li, Jun.,...&Liu, Chunliang.(2017).Calculation model for thermal-caused passive intermodulation product of microstrip lines.Xi'an Dianzi Keji Daxue Xuebao/Journal of Xidian University,44,120-126.
MLA	He, Yun,et al."Calculation model for thermal-caused passive intermodulation product of microstrip lines".Xi'an Dianzi Keji Daxue Xuebao/Journal of Xidian University 44(2017):120-126.

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