A silicon cantilever probe card with tip-to-pad electric feed-through and automatic isolation of the metal coating

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	A silicon cantilever probe card with tip-to-pad electric feed-through and automatic isolation of the metal coating
	Wang, F ; Li, XX ; Guo, NX ; Wang, YL ; Feng, SL
刊名	JOURNAL OF MICROMECHANICS AND MICROENGINEERING
	2006-01-01
卷号	16 期号:7 页码:1215-1220
ISSN号	0960-1317
通讯作者	Li, XX, Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, State Key Lab Transducer Technol, Shanghai 200050, Peoples R China
学科主题	Engineering, Electrical & Electronic; Nanoscience & Nanotechnology; Instruments & Instrumentation; Materials Science, Multidisciplinary; Mechanics
收录类别	SCI
语种	英语
公开日期	2011-11-08
内容类型	期刊论文
源URL	[http://ir.sim.ac.cn/handle/331004/17299]
专题	上海微系统与信息技术研究所_太赫兹、微波射频技术_期刊论文
推荐引用方式 GB/T 7714	Wang, F,Li, XX,Guo, NX,et al. A silicon cantilever probe card with tip-to-pad electric feed-through and automatic isolation of the metal coating[J]. JOURNAL OF MICROMECHANICS AND MICROENGINEERING,2006,16(7):1215-1220.
APA	Wang, F,Li, XX,Guo, NX,Wang, YL,&Feng, SL.(2006).A silicon cantilever probe card with tip-to-pad electric feed-through and automatic isolation of the metal coating.JOURNAL OF MICROMECHANICS AND MICROENGINEERING,16(7),1215-1220.
MLA	Wang, F,et al."A silicon cantilever probe card with tip-to-pad electric feed-through and automatic isolation of the metal coating".JOURNAL OF MICROMECHANICS AND MICROENGINEERING 16.7(2006):1215-1220.