CHF correlation of boiling in FC-72 with micro-pin-fins for electronics cooling | |
Zhang, Yonghai; Zhou, Jie; Zhou, Wenjing; Qi, Baojin; Wei, Jinjia | |
刊名 | APPLIED THERMAL ENGINEERING |
2018 | |
卷号 | 138页码:494-500 |
关键词 | Correlation Enhanced heat transfer Pool boiling CHF Micro-pin-fins |
ISSN号 | 1359-4311 |
URL标识 | 查看原文 |
内容类型 | 期刊论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/2919703 |
专题 | 西安交通大学 |
推荐引用方式 GB/T 7714 | Zhang, Yonghai,Zhou, Jie,Zhou, Wenjing,et al. CHF correlation of boiling in FC-72 with micro-pin-fins for electronics cooling[J]. APPLIED THERMAL ENGINEERING,2018,138:494-500. |
APA | Zhang, Yonghai,Zhou, Jie,Zhou, Wenjing,Qi, Baojin,&Wei, Jinjia.(2018).CHF correlation of boiling in FC-72 with micro-pin-fins for electronics cooling.APPLIED THERMAL ENGINEERING,138,494-500. |
MLA | Zhang, Yonghai,et al."CHF correlation of boiling in FC-72 with micro-pin-fins for electronics cooling".APPLIED THERMAL ENGINEERING 138(2018):494-500. |
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