A chip-scale chemical mechanical planarization model for copper interconnect structures

	A chip-scale chemical mechanical planarization model for copper interconnect structures
	Xu QZ(徐勤志); Fang JJ(方晶晶); Chen L(陈岚)
刊名	Microelectronic Engineering
	2015-09-05
公开日期	2016-06-02
内容类型	期刊论文
源URL	[http://10.10.10.126/handle/311049/15131]
专题	微电子研究所_EDA中心
作者单位	中国科学院微电子研究所
推荐引用方式 GB/T 7714	Xu QZ,Fang JJ,Chen L. A chip-scale chemical mechanical planarization model for copper interconnect structures[J]. Microelectronic Engineering,2015.
APA	Xu QZ,Fang JJ,&Chen L.(2015).A chip-scale chemical mechanical planarization model for copper interconnect structures.Microelectronic Engineering.
MLA	Xu QZ,et al."A chip-scale chemical mechanical planarization model for copper interconnect structures".Microelectronic Engineering (2015).