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Effect of tensile strain on adatom diffusion on Cu(111) surface
Wang, YX; Pan, ZY; Li, ZJ; Wei, Q; Zang, LK; Zhang, ZX
刊名SURFACE SCIENCE
2003-11-01
卷号545页码:137-142
关键词molecular dynamics copper adatoms surface diffusion surface stress
ISSN号0039-6028
DOI10.1016/j.susc.2003.09.005
英文摘要The dependence of the adatom diffusion on the strained (1 1 1) surface of Cu metal was investigated using molecular dynamics simulation. It is found that the diffusion coefficient of the Cu adatom on Cu surface decreases with increasing tensile strain at different temperatures where we studied. On the strained surface, the diffusion coefficient still exhibits approximately Arrhenius behavior. The main diffusion is the hopping diffusion. While, with the temperature or the tensile strain raised further, the exchange diffusion appears. And its frequency will increase with these values. (C) 2003 Elsevier B.V. All rights reserved.
WOS关键词SELF-DIFFUSION ; MOLECULAR-DYNAMICS ; AG
WOS研究方向Chemistry ; Physics
语种英语
出版者ELSEVIER SCIENCE BV
WOS记录号WOS:000186245700019
内容类型期刊论文
源URL[http://119.78.100.186/handle/113462/38537]  
专题中国科学院近代物理研究所
通讯作者Wang, YX
作者单位Fudan Univ, Inst Modern Phys, Shanghai 200433, Peoples R China
推荐引用方式
GB/T 7714
Wang, YX,Pan, ZY,Li, ZJ,et al. Effect of tensile strain on adatom diffusion on Cu(111) surface[J]. SURFACE SCIENCE,2003,545:137-142.
APA Wang, YX,Pan, ZY,Li, ZJ,Wei, Q,Zang, LK,&Zhang, ZX.(2003).Effect of tensile strain on adatom diffusion on Cu(111) surface.SURFACE SCIENCE,545,137-142.
MLA Wang, YX,et al."Effect of tensile strain on adatom diffusion on Cu(111) surface".SURFACE SCIENCE 545(2003):137-142.
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