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	Microstructure and thermoelectric properties of In2O3/ITO thin film thermocouples with Al2O3 protecting layer
	Liu, Yantao; Ren, Wei; Shi, Peng; Liu, Dan; Zhang, Yijun; Liu, Ming; Lin, Qijing; Tian, Bian; Jiang, Zhuangde
刊名	Journal of Materials Science: Materials in Electronics
	2019
卷号	30页码:1786-1793
关键词	Alumina substrates Long term service Performance capability Protecting layer Radio frequency magnetron sputtering method Spin-coating method Thermoelectric properties Thin film thermocouple
ISSN号	0957-4522
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/2826914
专题	西安交通大学
推荐引用方式 GB/T 7714	Liu, Yantao,Ren, Wei,Shi, Peng,et al. Microstructure and thermoelectric properties of In2O3/ITO thin film thermocouples with Al2O3 protecting layer[J]. Journal of Materials Science: Materials in Electronics,2019,30:1786-1793.
APA	Liu, Yantao.,Ren, Wei.,Shi, Peng.,Liu, Dan.,Zhang, Yijun.,...&Jiang, Zhuangde.(2019).Microstructure and thermoelectric properties of In2O3/ITO thin film thermocouples with Al2O3 protecting layer.Journal of Materials Science: Materials in Electronics,30,1786-1793.
MLA	Liu, Yantao,et al."Microstructure and thermoelectric properties of In2O3/ITO thin film thermocouples with Al2O3 protecting layer".Journal of Materials Science: Materials in Electronics 30(2019):1786-1793.

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