Fluid flow and heat transfer characteristics of liquid cooling   microchannels in LTCC multilayered packaging substrate

doi:10.1016/j.ijheatmasstransfer.2014.12.079

CORC > 北京大学 > 工学院

	Fluid flow and heat transfer characteristics of liquid cooling microchannels in LTCC multilayered packaging substrate
	Zhang, Lan-Ying ; Zhang, Yang-Fei ; Chen, Jia-Qi ; Bai, Shu-Lin
刊名	国际传热与传质杂志
	2015
关键词	Fluid flow Heat transfer Microchannel LTCC High power RECTANGULAR MICROCHANNELS ROUGHNESS SYSTEM SINKS
DOI	10.1016/j.ijheatmasstransfer.2014.12.079
英文摘要	The fluid flow and heat transfer of liquid cooling microchannels embedded in low temperature co-fired ceramic (LTCC) multilayered electronic packaging substrate have been investigated. Four cooling systems were supplied for high power application of 100W LED lamp, including aluminum finned heat sink and LTCC substrates with parallel, serpentine and spiral microchannels. The pressure, flow rate, Reynolds number, fiction factor, Poiseuille number and Nusselt number were experimentally measured and theoretically analyzed. The heat transfer behaviors characterized by the drop of maximum working temperature and temperature distribution were measured by a thermal video system based on infrared thermometry. The microstructure and roughness of microchannel were studied by using Scanning Electron Microscope and Tribo Indenter. The measured flow rate of parallel microchannel under the same inlet pressure was much higher than those of serpentine and spiral microchannels. A linear dependence of Nusselt number on Reynolds number was observed and conformed to the convective heat transfer mechanism in microchannel. The parallel microchannel was found to have the best heat transfer performance and reduced the maximum working temperature to 99.52 degrees C, much lower than those of other cooling systems. The temperature distribution of LED lamp was also significantly improved by the internal parallel liquid cooling microchannel in LTCC substrate. (C) 2015 Elsevier Ltd. All rights reserved.; http://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcApp=PARTNER_APP&SrcAuth=LinksAMR&KeyUT=WOS:000351799000032&DestLinkType=FullRecord&DestApp=ALL_WOS&UsrCustomerID=8e1609b174ce4e31116a60747a720701 ; Thermodynamics; Engineering, Mechanical; Mechanics; SCI(E); EI; 10; ARTICLE; zhangyangfei@pku.edu.cn; 339-345; 84
语种	英语
内容类型	期刊论文
源URL	[http://ir.pku.edu.cn/handle/20.500.11897/154139]
专题	工学院
推荐引用方式 GB/T 7714	Zhang, Lan-Ying,Zhang, Yang-Fei,Chen, Jia-Qi,et al. Fluid flow and heat transfer characteristics of liquid cooling microchannels in LTCC multilayered packaging substrate[J]. 国际传热与传质杂志,2015.
APA	Zhang, Lan-Ying,Zhang, Yang-Fei,Chen, Jia-Qi,&Bai, Shu-Lin.(2015).Fluid flow and heat transfer characteristics of liquid cooling microchannels in LTCC multilayered packaging substrate.国际传热与传质杂志.
MLA	Zhang, Lan-Ying,et al."Fluid flow and heat transfer characteristics of liquid cooling microchannels in LTCC multilayered packaging substrate".国际传热与传质杂志 (2015).