CORC  > 北京大学  > 信息科学技术学院
Study of silicon-based MEMS technology and its standard process
Wang, Yang-Yuan ; Wu, Guo-Ying ; Hao, Yi-Long ; Zhang, Da-Cheng ; Xiao, Zhi-Xiong ; Li, Ting ; Zhang, Guo-Bing ; Zhang, Jin-Wen
刊名tien tzu hsueh paoacta electronica sinica
2002
英文摘要The four sets of standard processes developed by Institute of Microelectronics of Peking University are presented. In these four sets of standard process, three of them are bulk micromachining processes and one is surface sacrificial process. The key technologies used in these processes were studied systematically. Research work included: systematically study how to control the stress of polysilicon film; developed two anti-stiction technologies; research of Si/Si bonding, Si/Ni/Si bonding and Si/glass bonding; study and optimisation of high aspect ratio silicon etching; successfully reducing RIE Lag from 23% to 5%; exploiting two kinds of multi-step silicon etching technologies.; EI; 0; 11; 1577-1584; 30
语种英语
内容类型期刊论文
源URL[http://ir.pku.edu.cn/handle/20.500.11897/408224]  
专题信息科学技术学院
推荐引用方式
GB/T 7714
Wang, Yang-Yuan,Wu, Guo-Ying,Hao, Yi-Long,et al. Study of silicon-based MEMS technology and its standard process[J]. tien tzu hsueh paoacta electronica sinica,2002.
APA Wang, Yang-Yuan.,Wu, Guo-Ying.,Hao, Yi-Long.,Zhang, Da-Cheng.,Xiao, Zhi-Xiong.,...&Zhang, Jin-Wen.(2002).Study of silicon-based MEMS technology and its standard process.tien tzu hsueh paoacta electronica sinica.
MLA Wang, Yang-Yuan,et al."Study of silicon-based MEMS technology and its standard process".tien tzu hsueh paoacta electronica sinica (2002).
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