Thermal Impact on the Resistance Switching Properties in Tantalum Oxide Based RRAM | |
Mao, Jun ; Cai, Yimao ; Tan, Shenghu ; Pan, Yue ; Zhang, Yaokai ; Huang, Ru | |
2012 | |
英文摘要 | In this paper, the switching layer thickness and temperature impacts on resistance switching polarity of tantalum oxide (TaOx) based resistive random access memory (RRAM) have been investigated. Our results show that at room temperature unipolar behavior was activated in thick TaOx, but failed in thin TaOx, while in 280 degrees C condition thin TaOx layer RRAM can also show stable unipolar characteristics. For thick TaOx device, the unipolar behavior is attributed to more heat accumulation in thicker switching layer. In 280 degrees C condition, stable unipolar characteristic of thin TaOx device is due to extra ambient heat offered. In addition, thin TaOx RRAM with SiO2 buffer layer is also fabricated to investigate the heat accumulation impact on operation polarity of RRAM devices. These results are helpful in obtaining the insight on understanding the switching mechanism of TaOx RRAM and improve the RRAM device performance and reliability capability.; Engineering, Electrical & Electronic; Physics, Applied; EI; CPCI-S(ISTP); 0 |
语种 | 英语 |
DOI标识 | 10.1109/ICSICT.2012.6467604 |
内容类型 | 其他 |
源URL | [http://ir.pku.edu.cn/handle/20.500.11897/405898] |
专题 | 信息科学技术学院 |
推荐引用方式 GB/T 7714 | Mao, Jun,Cai, Yimao,Tan, Shenghu,et al. Thermal Impact on the Resistance Switching Properties in Tantalum Oxide Based RRAM. 2012-01-01. |
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