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	A surface micromachining process utilizing dual metal sacrificial layer for fabrication of RF MEMS switch
	Liu, Bo ; Lv, Zhiqiu ; Li, Zhihong ; He, Xunjun ; Hao, Yilong
	2010
英文摘要	We have developed a surface micromachining process utilizing the Cu - Ni dual metal layer as the sacrificial layer to fabricate the metal-contact RF MEMS switch. No seed layer is required for electroplating the structural layer, when the metallic sacrificial layer, such as Ni and Cu, is employed. Some inherit problems were found when using a single metal sacrificial layer. Our experimental results showed that a rough bottom surface of the structural layer would be obtained by use of Cu as the sacrificial layer solely, and an unacceptable stress would be induced by use of Ni. In contrast, applying Cu - Ni dual sacrificial layer led in the smooth structural surface and insignificant residual stress. A fabricated switch was demonstrated here. ?2010 IEEE.; EI; 0
语种	英语
DOI标识	10.1109/NEMS.2010.5592479
内容类型	其他
源URL	[http://ir.pku.edu.cn/handle/20.500.11897/295516]
专题	信息科学技术学院
推荐引用方式 GB/T 7714	Liu, Bo,Lv, Zhiqiu,Li, Zhihong,et al. A surface micromachining process utilizing dual metal sacrificial layer for fabrication of RF MEMS switch. 2010-01-01.

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