Investigation of silicon/glass anodic bonding with PECVD silicon carbide   as the intermediate layer

doi:10.1088/0960-1317/22/9/095011

CORC > 北京大学 > 信息科学技术学院

	Investigation of silicon/glass anodic bonding with PECVD silicon carbide as the intermediate layer
	Tang, W. ; Meng, B. ; Su, W. ; Zhang, H. X.
刊名	journal of micromechanics and microengineering
	2012
关键词	THIN-FILMS GLASS PRESSURE NITRIDE SENSORS OXIDE
DOI	10.1088/0960-1317/22/9/095011
英文摘要	This paper describes the study of the conventional silicon/glass anodic bonding with plasma enhanced chemical vapor deposited silicon carbide (PE-SiC) as the intermediate layer, in order to evaluate the feasibilities of applying PE-SiC as the device's passivation layer prior to the packaging bonding and construction layer based on the bond-and-transfer technique. It is found that the mechanism of this bonding is similar to the traditional anodic bonding. As the PE-SiC thickened, the bond strength declined; meanwhile, the leak rate remained at the same level with the silicon/glass bonding. Further experiments revealed that the bonding increased the interlayer's tensile stress by 70.7 MPa and diminished the stress gradient by 24.6 MPa mu m(-1).; http://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcApp=PARTNER_APP&SrcAuth=LinksAMR&KeyUT=WOS:000308210600021&DestLinkType=FullRecord&DestApp=ALL_WOS&UsrCustomerID=8e1609b174ce4e31116a60747a720701 ; Engineering, Electrical & Electronic; Nanoscience & Nanotechnology; Instruments & Instrumentation; Materials Science, Multidisciplinary; Mechanics; SCI(E); EI; 3; ARTICLE; 9; 22
语种	英语
内容类型	期刊论文
源URL	[http://ir.pku.edu.cn/handle/20.500.11897/291818]
专题	信息科学技术学院
推荐引用方式 GB/T 7714	Tang, W.,Meng, B.,Su, W.,et al. Investigation of silicon/glass anodic bonding with PECVD silicon carbide as the intermediate layer[J]. journal of micromechanics and microengineering,2012.
APA	Tang, W.,Meng, B.,Su, W.,&Zhang, H. X..(2012).Investigation of silicon/glass anodic bonding with PECVD silicon carbide as the intermediate layer.journal of micromechanics and microengineering.
MLA	Tang, W.,et al."Investigation of silicon/glass anodic bonding with PECVD silicon carbide as the intermediate layer".journal of micromechanics and microengineering (2012).