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Grain refinement of micrometer-scale Cu foils through accumulative cyclic deformation
Liang, F; Dai, CY; Zhang, GP
刊名MATERIALS RESEARCH EXPRESS
2018-06-01
卷号5期号:6页码:-
关键词grain refinement cyclic loading strain rate Cu foil micron scale
ISSN号2053-1591
DOI10.1088/2053-1591/aac93b
英文摘要The microstructure evolution of the 190 mu m-thick Cu foils subjected to repeatedly bending loading was investigated. Wefound that the grains in the micron-scale foil were refined into subgrains with a size of about 0.5 mu mthrough a removal of twin boundaries and an introduction of a high frequency of high angle boundaries (> 15 degrees) with accumulative cyclic deformation. With increasing strain rate (loading frequency), the grains are completely refined into well-defined fine grains with high angle boundaries. Such the microstructure refinement induced by accumulative cyclic deformation may provide a potential strategy for grain refinement of small-scale materials.
学科主题Materials Science, Multidisciplinary
语种英语
WOS记录号WOS:000435208200001
内容类型期刊论文
源URL[http://ir.imr.ac.cn/handle/321006/80168]  
专题金属研究所_中国科学院金属研究所
作者单位1.[Liang, F.
2.Dai, C. Y.] Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, 72 Wenhua Rd, Shenyang 110016, Liaoning, Peoples R China
3.[Liang, F.
4.Zhang, G. P.] Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Liaoning, Peoples R China
5.[Dai, C. Y.] Shenyang Univ Chem Technol, Sch Mat Sci Engn, Shenyang 110142, Liaoning, Peoples R China
推荐引用方式
GB/T 7714
Liang, F,Dai, CY,Zhang, GP. Grain refinement of micrometer-scale Cu foils through accumulative cyclic deformation[J]. MATERIALS RESEARCH EXPRESS,2018,5(6):-.
APA Liang, F,Dai, CY,&Zhang, GP.(2018).Grain refinement of micrometer-scale Cu foils through accumulative cyclic deformation.MATERIALS RESEARCH EXPRESS,5(6),-.
MLA Liang, F,et al."Grain refinement of micrometer-scale Cu foils through accumulative cyclic deformation".MATERIALS RESEARCH EXPRESS 5.6(2018):-.
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