Silicon bench for passive coupling and packaging of high-frequency optoelectronic devices | |
Yang, H.; Zhu, H. L.; Xie, H. Y.; Zhao, L. J.; Zhou, F.; Wang, W. | |
刊名 | Ieee transactions on advanced packaging |
2007-02-01 | |
卷号 | 30期号:1页码:34-37 |
关键词 | Coplanar waveguide (cpw) Low microwave loss High-frequency Optoelectronic packaging Passive coupling Silicon bench V-groove |
ISSN号 | 1521-3323 |
DOI | 10.1109/tadvp.2006.890214 |
通讯作者 | Yang, h.() |
英文摘要 | Coupling and packaging have become decisive factors in the final performance and cost of high-frequency optoelectronic devices. here, we report the design and successful fabrication of a silicon bench that integrates a v-groove and high-frequency coplanar waveguide (cpw) on the same high-resistivity silicon wafer as an effective optoelectronic packaging solution. |
WOS研究方向 | Engineering ; Materials Science |
WOS类目 | Engineering, Manufacturing ; Engineering, Electrical & Electronic ; Materials Science, Multidisciplinary |
语种 | 英语 |
出版者 | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC |
WOS记录号 | WOS:000244191100005 |
内容类型 | 期刊论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/2427069 |
专题 | 半导体研究所 |
通讯作者 | Yang, H. |
作者单位 | Chinese Acad Sci, Inst Semicond, Optoelect R&D Ctr, Beijing 100864, Peoples R China |
推荐引用方式 GB/T 7714 | Yang, H.,Zhu, H. L.,Xie, H. Y.,et al. Silicon bench for passive coupling and packaging of high-frequency optoelectronic devices[J]. Ieee transactions on advanced packaging,2007,30(1):34-37. |
APA | Yang, H.,Zhu, H. L.,Xie, H. Y.,Zhao, L. J.,Zhou, F.,&Wang, W..(2007).Silicon bench for passive coupling and packaging of high-frequency optoelectronic devices.Ieee transactions on advanced packaging,30(1),34-37. |
MLA | Yang, H.,et al."Silicon bench for passive coupling and packaging of high-frequency optoelectronic devices".Ieee transactions on advanced packaging 30.1(2007):34-37. |
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