Extreme wettability due to dendritic copper nanostructure via electrodeposition

doi:10.1016/j.apsusc.2011.04.126

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	Extreme wettability due to dendritic copper nanostructure via electrodeposition
	Wang, Peng 1; Zhang, Dun 1; Qiu, Ri 1,2; Zhang, D (reprint author), Chinese Acad Sci, Inst Oceanol, Shandong Prov Key Lab Corros Sci, 7 Naihai Rd, Qingdao 266071, Peoples R China
刊名	APPLIED SURFACE SCIENCE
	2011-08-01
卷号	257 期号:20 页码:8438-8442
关键词	Electrodeposition Super-hydrophobicity Super-hydrophilicity Dendritic Copper
ISSN号	0169-4332
DOI	10.1016/j.apsusc.2011.04.126
文献子类	Article
英文摘要	Dendritic copper film with convertible extreme wettability is prepared on metal surface via electrodeposition. With field emission scanning electron microscopy (FESEM), X-ray diffraction (XRD) and electrochemical measurement, the morphology, composition and formation mechanism of dendritic copper film were studied. It is found that the film is mainly composed of metallic copper. Also some residual cuprous oxide and chloride exist in the deposit. The single micron-sized dendrite consists of a main stem with side branches, on which the higher-order branches with the dimension of tens of nanometers grow. A hydrophobic modification can induce the conversion of the apparent wettability of film from super-hydrophilicity (with apparent water contact angle of 5 +/- 3 degrees) to super-hydrophobicity (with apparent water contact angle of 154.1 +/- 3 degrees), which is due to the capillary effect. The method proposed in this paper is time-saving and facile to operate, and it offers a promising technique to prepare metallic surface with a high wettability contrast for water. (C) 2011 Elsevier B. V. All rights reserved.; Dendritic copper film with convertible extreme wettability is prepared on metal surface via electrodeposition. With field emission scanning electron microscopy (FESEM), X-ray diffraction (XRD) and electrochemical measurement, the morphology, composition and formation mechanism of dendritic copper film were studied. It is found that the film is mainly composed of metallic copper. Also some residual cuprous oxide and chloride exist in the deposit. The single micron-sized dendrite consists of a main stem with side branches, on which the higher-order branches with the dimension of tens of nanometers grow. A hydrophobic modification can induce the conversion of the apparent wettability of film from super-hydrophilicity (with apparent water contact angle of 5 +/- 3 degrees) to super-hydrophobicity (with apparent water contact angle of 154.1 +/- 3 degrees), which is due to the capillary effect. The method proposed in this paper is time-saving and facile to operate, and it offers a promising technique to prepare metallic surface with a high wettability contrast for water. (C) 2011 Elsevier B. V. All rights reserved.
学科主题	Chemistry ; Materials Science ; Physics
URL标识	查看原文
语种	英语
WOS记录号	WOS:000291725100024
公开日期	2012-07-03
内容类型	期刊论文
源URL	[http://ir.qdio.ac.cn/handle/337002/11446]
专题	海洋研究所_海洋腐蚀与防护研究发展中心
通讯作者	Zhang, D (reprint author), Chinese Acad Sci, Inst Oceanol, Shandong Prov Key Lab Corros Sci, 7 Naihai Rd, Qingdao 266071, Peoples R China
作者单位	1.Chinese Acad Sci, Inst Oceanol, Shandong Prov Key Lab Corros Sci, Qingdao 266071, Peoples R China 2.Chinese Acad Sci, Grad Sch, Beijing 100039, Peoples R China
推荐引用方式 GB/T 7714	Wang, Peng,Zhang, Dun,Qiu, Ri,et al. Extreme wettability due to dendritic copper nanostructure via electrodeposition[J]. APPLIED SURFACE SCIENCE,2011,257(20):8438-8442.
APA	Wang, Peng,Zhang, Dun,Qiu, Ri,&Zhang, D .(2011).Extreme wettability due to dendritic copper nanostructure via electrodeposition.APPLIED SURFACE SCIENCE,257(20),8438-8442.
MLA	Wang, Peng,et al."Extreme wettability due to dendritic copper nanostructure via electrodeposition".APPLIED SURFACE SCIENCE 257.20(2011):8438-8442.