pH-induced phase evolution and enhanced physical properties of co-precipitated WO3-CuO powders and reduced bodies for microelectronics packaging
Zhang, Le; Zhen, Fangzheng; Wang, Zhongying; Jiang, Zhigang; Wei, Shuai; Fu, Xianzhu; Sun, Rong; Wong, Chingping; Bu, Wei; Chen, Hao
刊名CERAMICS INTERNATIONAL
2018
文献子类期刊论文
英文摘要WO3-CuO powder and its reduced bodies for microelectronics packaging were successfully prepared by co-precipitation combined with reductive sintering in H-2 atmosphere. The phase evolutions, morphologies, and agglomeration states of the co-precipitated precursors and dried and reduced powders under different pH values were studied in detail. Furthermore, the physical properties of the sintered bodies were investigated. The experimental result demonstrated that the morphology of the co-precipitated powders could be remarkably influenced by the pH values of the reaction solution. The prepared WO3-CuO powder under pH = 4 exhibited a uniform size distribution and better dispersibility, and the corresponding sintered bodies showed a dense and defect-free microstructure. Thermal conductivity as high as 221.0 W m(-1) K-1 and an expansion coefficient lower than 6.6 x 10(-6) K-1 were simultaneously obtained in the sintered bodies. The W-Cu reduced bodies in this study possess great potential for application in electronics packaging.
语种英语
内容类型期刊论文
源URL[http://ir.siat.ac.cn:8080/handle/172644/14879]  
专题深圳先进技术研究院_其他
推荐引用方式
GB/T 7714
Zhang, Le,Zhen, Fangzheng,Wang, Zhongying,et al. pH-induced phase evolution and enhanced physical properties of co-precipitated WO3-CuO powders and reduced bodies for microelectronics packaging[J]. CERAMICS INTERNATIONAL,2018.
APA Zhang, Le.,Zhen, Fangzheng.,Wang, Zhongying.,Jiang, Zhigang.,Wei, Shuai.,...&Chen, Hao.(2018).pH-induced phase evolution and enhanced physical properties of co-precipitated WO3-CuO powders and reduced bodies for microelectronics packaging.CERAMICS INTERNATIONAL.
MLA Zhang, Le,et al."pH-induced phase evolution and enhanced physical properties of co-precipitated WO3-CuO powders and reduced bodies for microelectronics packaging".CERAMICS INTERNATIONAL (2018).
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