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	Cu (II) as a catalyst for hydrogen peroxide system abrasive-free polishing on hard disk substrate
	Wang, Zhijun[1]; Lei, Hong[2]; Zhang, Weitao[3]; Zhao, Rong[4]
	2013
会议名称	MICRO-NANO TECHNOLOGY XIV, PTS 1-4
会议日期	2012-11-04
关键词	Cu (II) catalyst abrasive-free polishing (AFP) MRR
页码	91-95
URL标识	查看原文
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/2290127
专题	上海大学
作者单位	1.[1]Shanghai Univ, Res Ctr Nanosci & Nanotechnol, Shanghai 200444, Peoples R China. 2.[2]Shanghai Univ, Res Ctr Nanosci & Nanotechnol, Shanghai 200444, Peoples R China. 3.[3]Shanghai Univ, Res Ctr Nanosci & Nanotechnol, Shanghai 200444, Peoples R China. 4.[4]Shanghai Univ, Res Ctr Nanosci & Nanotechnol, Shanghai 200444, Peoples R China.
推荐引用方式 GB/T 7714	Wang, Zhijun[1],Lei, Hong[2],Zhang, Weitao[3],et al. Cu (II) as a catalyst for hydrogen peroxide system abrasive-free polishing on hard disk substrate[C]. 见:MICRO-NANO TECHNOLOGY XIV, PTS 1-4. 2012-11-04.

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