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	Development of Structure Function Analysis System for Power Semiconductor Devices
	Que, Xiufu[1]; Liu, Yanan[2]; Yang, Lianqiao[3]; Chen, Wei[4]; Zhang, Jianhua[5]
	2015
会议名称	16 int conf elect packaging technology
会议日期	2015-01-01
关键词	semiconductor transient thermal test K coefficient cooling curve structure function
页码	770-774
URL标识	查看原文
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/2240344
专题	上海大学
作者单位	1.[1]Shanghai Univ, Sch Mechatron Engn & Automat, Shanghai 200072, Peoples R China. 2.Shanghai Univ, Minist Educ, Key Lab Adv Display & Syst Applicat, Shanghai 200072, Peoples R China. 3.[2]Shanghai Univ, Sch Mat Sci & Engn, Shanghai 20072, Peoples R China. 4.Shanghai Univ, Minist Educ, Key Lab Adv Display & Syst Applicat, Shanghai 200072, Peoples R China. 5.[3]Shanghai Univ, Sch Mat Sci & Engn, Shanghai 20072, Peoples R China. 6.Shanghai Univ, Minist Educ, Key Lab Adv Display & Syst Applicat, Shanghai 200072, Peoples R China. 7.[4]Shanghai Univ, Sch Mat Sci & Engn, Shanghai 20072, Peoples R China. 8.Shanghai Univ, Minist Educ, Key Lab Adv Display & Syst Applicat, Shanghai 200072, Peoples R China. 9.[5]Shanghai Univ, Sch Mechatron Engn & Automat, Shanghai 200072, Peoples R China. 10.Shanghai Univ, Minist Educ, Key Lab Adv Display & Syst Applicat, Shanghai 200072, Peoples R China.
推荐引用方式 GB/T 7714	Que, Xiufu[1],Liu, Yanan[2],Yang, Lianqiao[3],et al. Development of Structure Function Analysis System for Power Semiconductor Devices[C]. 见:16 int conf elect packaging technology. 2015-01-01.

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