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	Development and Characterization of Graphene Enhanced Thermal Conductive Adhesives
	Wang, Nan[1]; Logothetis, Nikolaos[2]; Wei, Mu[3]; Huang, Shirong[4]; Ye, Lilei[5]; Liu, Johan[6]
	2016
会议名称	6th Electronic System-Integration Technology Conference (ESTC)
会议日期	2016-09-13
URL标识	查看原文
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/2235121
专题	上海大学
作者单位	1.[1]Chalmers, Dept Microtechnol & Nanosci MC2, Kemivagen 9, SE-41296 Gothenburg, Sweden. 2.[2]Chalmers, Dept Microtechnol & Nanosci MC2, Kemivagen 9, SE-41296 Gothenburg, Sweden. 3.SHT Smart High Tech AS, Aschebergsgatan 46, SE-41133 Gothenburg, Sweden. 4.[3]Chalmers, Dept Microtechnol & Nanosci MC2, Kemivagen 9, SE-41296 Gothenburg, Sweden. 5.Shanghai Univ, Sch Mech Engn & Automat, Inst NanomicroEnergy, SMIT Ctr, Jiading Campus,20 Chengzhong Rd, Shanghai 201800, Peoples R China. 6.[4]Shanghai Univ, Sch Mech Engn & Automat, Inst NanomicroEnergy, SMIT Ctr, Jiading Campus,20 Chengzhong Rd, Shanghai 201800, Peoples R China. 7.[5]SHT Smart High Tech AS, Aschebergsgatan 46, SE-41133 Gothenburg, Sweden. 8.[6]Chalmers, Dept Microtechnol & Nanosci MC2, Kemivagen 9, SE-41296 Gothenburg, Sweden. 9.Shanghai Univ, Sch Mech Engn & Automat, Inst NanomicroEnergy, SMIT Ctr, Jiading Campus,20 Chengzhong Rd, Shanghai 201800, Peoples R China.
推荐引用方式 GB/T 7714	Wang, Nan[1],Logothetis, Nikolaos[2],Wei, Mu[3],et al. Development and Characterization of Graphene Enhanced Thermal Conductive Adhesives[C]. 见:6th Electronic System-Integration Technology Conference (ESTC). 2016-09-13.

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