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	Wrinkling Analysis in a Film Bonded to a Compressible Compliant Substrate in Large Deformation
	Ou, Zhicheng[1]; Yao, Xiaohu[1]; Zhang, Xiaoqing[1]; Fan, Xuejun[2]
刊名	CMC-COMPUTERS MATERIALS & CONTINUA
	2014
卷号	44页码:205-221
关键词	film substrate buckling large deformation neo-Hookean
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/2217283
专题	华南理工大学
作者单位	1.[1]S China Univ Technol, Sch Civil Engn & Transportat, Guangzhou 510640, Guangdong, Peoples R China 2.[2]Lamar Univ, Dept Mech Engn, Beaumont, TX 77710 USA
推荐引用方式 GB/T 7714	Ou, Zhicheng[1],Yao, Xiaohu[1],Zhang, Xiaoqing[1],et al. Wrinkling Analysis in a Film Bonded to a Compressible Compliant Substrate in Large Deformation[J]. CMC-COMPUTERS MATERIALS & CONTINUA,2014,44:205-221.
APA	Ou, Zhicheng[1],Yao, Xiaohu[1],Zhang, Xiaoqing[1],&Fan, Xuejun[2].(2014).Wrinkling Analysis in a Film Bonded to a Compressible Compliant Substrate in Large Deformation.CMC-COMPUTERS MATERIALS & CONTINUA,44,205-221.
MLA	Ou, Zhicheng[1],et al."Wrinkling Analysis in a Film Bonded to a Compressible Compliant Substrate in Large Deformation".CMC-COMPUTERS MATERIALS & CONTINUA 44(2014):205-221.

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