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Tough bonding of metallic layers to hydrocarbon surfaces by depositing Ag films (EI收录)
Chen, Dexin[1]; Kang, Zhixin[1]; Bessho, Takeshi[2]
刊名RSC Advances
2016
卷号6页码:72256-72262
关键词Chemical activation Electromagnetic shielding Electronics industry Hydrocarbons Metallizing Metals Palladium Plastic coatings Plating Topography
URL标识查看原文
内容类型期刊论文
URI标识http://www.corc.org.cn/handle/1471x/2193665
专题华南理工大学
作者单位1.[1] Guangdong Key Laboratory for Advanced Metallic Materials Processing, School of Mechanical and Automotive Engineering, South China University of Technology, 381 Wushan, Guangzhou
2.510640, China
3.[2] Higashifuji Technical Center, Toyota Motor Corporation, 1200 Mishuku, Susono, Shizuoka
4.410-1193, Japan
推荐引用方式
GB/T 7714
Chen, Dexin[1],Kang, Zhixin[1],Bessho, Takeshi[2]. Tough bonding of metallic layers to hydrocarbon surfaces by depositing Ag films (EI收录)[J]. RSC Advances,2016,6:72256-72262.
APA Chen, Dexin[1],Kang, Zhixin[1],&Bessho, Takeshi[2].(2016).Tough bonding of metallic layers to hydrocarbon surfaces by depositing Ag films (EI收录).RSC Advances,6,72256-72262.
MLA Chen, Dexin[1],et al."Tough bonding of metallic layers to hydrocarbon surfaces by depositing Ag films (EI收录)".RSC Advances 6(2016):72256-72262.
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