Tough bonding of metallic layers to hydrocarbon surfaces by depositing Ag films (EI收录) | |
Chen, Dexin[1]; Kang, Zhixin[1]; Bessho, Takeshi[2] | |
刊名 | RSC Advances |
2016 | |
卷号 | 6页码:72256-72262 |
关键词 | Chemical activation Electromagnetic shielding Electronics industry Hydrocarbons Metallizing Metals Palladium Plastic coatings Plating Topography |
URL标识 | 查看原文 |
内容类型 | 期刊论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/2193665 |
专题 | 华南理工大学 |
作者单位 | 1.[1] Guangdong Key Laboratory for Advanced Metallic Materials Processing, School of Mechanical and Automotive Engineering, South China University of Technology, 381 Wushan, Guangzhou 2.510640, China 3.[2] Higashifuji Technical Center, Toyota Motor Corporation, 1200 Mishuku, Susono, Shizuoka 4.410-1193, Japan |
推荐引用方式 GB/T 7714 | Chen, Dexin[1],Kang, Zhixin[1],Bessho, Takeshi[2]. Tough bonding of metallic layers to hydrocarbon surfaces by depositing Ag films (EI收录)[J]. RSC Advances,2016,6:72256-72262. |
APA | Chen, Dexin[1],Kang, Zhixin[1],&Bessho, Takeshi[2].(2016).Tough bonding of metallic layers to hydrocarbon surfaces by depositing Ag films (EI收录).RSC Advances,6,72256-72262. |
MLA | Chen, Dexin[1],et al."Tough bonding of metallic layers to hydrocarbon surfaces by depositing Ag films (EI收录)".RSC Advances 6(2016):72256-72262. |
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