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	Nd3+-doped colloidal SiO2 composite abrasives: Synthesis and the effects on chemical mechanical polishing (CMP) performances of sapphire wafers
	Liu, Tingting[1]; Lei, Hong[2]
刊名	APPLIED SURFACE SCIENCE
	2017
卷号	413页码:16-26
关键词	Nd3+-doped colloidal SiO2 composite abrasives Chemical mechanical polishing (CMP) Sapphire Material removal rate (MRR)
ISSN号	0169-4332
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/2190720
专题	上海大学
作者单位	1.[1]Shanghai Univ, Res Ctr Nanosci & Nanotechnol, Shanghai 200444, Peoples R China. 2.[2]Shanghai Univ, Res Ctr Nanosci & Nanotechnol, Shanghai 200444, Peoples R China.
推荐引用方式 GB/T 7714	Liu, Tingting[1],Lei, Hong[2]. Nd3+-doped colloidal SiO2 composite abrasives: Synthesis and the effects on chemical mechanical polishing (CMP) performances of sapphire wafers[J]. APPLIED SURFACE SCIENCE,2017,413:16-26.
APA	Liu, Tingting[1],&Lei, Hong[2].(2017).Nd3+-doped colloidal SiO2 composite abrasives: Synthesis and the effects on chemical mechanical polishing (CMP) performances of sapphire wafers.APPLIED SURFACE SCIENCE,413,16-26.
MLA	Liu, Tingting[1],et al."Nd3+-doped colloidal SiO2 composite abrasives: Synthesis and the effects on chemical mechanical polishing (CMP) performances of sapphire wafers".APPLIED SURFACE SCIENCE 413(2017):16-26.

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