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	Coupling effect of thermomigration and cross-interaction on evolution of intermetallic compounds in Cu/Sn/Ni ultrafine interconnects undergoing TLP bonding
	Zhong, Yi[1]; Zhao, Ning[2]; Dong, Wei[3]; Ma, Haitao[4]; Huang, Mingliang[5]; Yin, Luqiao[6]; Wong, Chingping[7]
刊名	JOURNAL OF MATERIALS RESEARCH
	2017
卷号	32页码:3128-3136
ISSN号	0884-2914
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/2184371
专题	上海大学
作者单位	1.[1]Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China. 2.[2]Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China. 3.[3]Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China. 4.[4]Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China. 5.[5]Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China. 6.[6]Shanghai Univ, Minist Educ, Key Lab Adv Display & Syst Applicat, Shanghai 200072, Peoples R China. 7.[7]Georgia Inst Technol, Sch Mat Sci & Engn, Atlanta, GA 30332 USA.
推荐引用方式 GB/T 7714	Zhong, Yi[1],Zhao, Ning[2],Dong, Wei[3],et al. Coupling effect of thermomigration and cross-interaction on evolution of intermetallic compounds in Cu/Sn/Ni ultrafine interconnects undergoing TLP bonding[J]. JOURNAL OF MATERIALS RESEARCH,2017,32:3128-3136.
APA	Zhong, Yi[1].,Zhao, Ning[2].,Dong, Wei[3].,Ma, Haitao[4].,Huang, Mingliang[5].,...&Wong, Chingping[7].(2017).Coupling effect of thermomigration and cross-interaction on evolution of intermetallic compounds in Cu/Sn/Ni ultrafine interconnects undergoing TLP bonding.JOURNAL OF MATERIALS RESEARCH,32,3128-3136.
MLA	Zhong, Yi[1],et al."Coupling effect of thermomigration and cross-interaction on evolution of intermetallic compounds in Cu/Sn/Ni ultrafine interconnects undergoing TLP bonding".JOURNAL OF MATERIALS RESEARCH 32(2017):3128-3136.

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