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	Hydrogen Bond-Regulated Boron Nitride Network Structures for Improved Thermal Conductive Property of Polyamide-imide Composites
	Jiang, Fang[1]; Cui, Siqi[2]; Song, Na[3]; Shi, Liyi[4]; Ding, Peng[5]
刊名	ACS APPLIED MATERIALS & INTERFACES
	2018
卷号	10页码:16812-16821
关键词	boron nitride interconnected network hydrogen bond thermal conductivity thermoplastic composites
ISSN号	1944-8244
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/2175400
专题	上海大学
作者单位	1.[1]Shanghai Univ, Res Ctr Nanosci & Nanotechnol, 99 Shangda Rd, Shanghai 200444, Peoples R China. 2.[2]Shanghai Univ, Sch Mat Sci & Engn, 99 Shangda Rd, Shanghai 200444, Peoples R China. 3.[3]Shanghai Univ, Res Ctr Nanosci & Nanotechnol, 99 Shangda Rd, Shanghai 200444, Peoples R China. 4.[4]Shanghai Univ, Res Ctr Nanosci & Nanotechnol, 99 Shangda Rd, Shanghai 200444, Peoples R China. 5.[5]Shanghai Univ, Res Ctr Nanosci & Nanotechnol, 99 Shangda Rd, Shanghai 200444, Peoples R China.
推荐引用方式 GB/T 7714	Jiang, Fang[1],Cui, Siqi[2],Song, Na[3],et al. Hydrogen Bond-Regulated Boron Nitride Network Structures for Improved Thermal Conductive Property of Polyamide-imide Composites[J]. ACS APPLIED MATERIALS & INTERFACES,2018,10:16812-16821.
APA	Jiang, Fang[1],Cui, Siqi[2],Song, Na[3],Shi, Liyi[4],&Ding, Peng[5].(2018).Hydrogen Bond-Regulated Boron Nitride Network Structures for Improved Thermal Conductive Property of Polyamide-imide Composites.ACS APPLIED MATERIALS & INTERFACES,10,16812-16821.
MLA	Jiang, Fang[1],et al."Hydrogen Bond-Regulated Boron Nitride Network Structures for Improved Thermal Conductive Property of Polyamide-imide Composites".ACS APPLIED MATERIALS & INTERFACES 10(2018):16812-16821.

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