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	Materials informatics
	Ramakrishna, Seeram[1]; Zhang, Tong-Yi[2]; Lu, Wen-Cong[3]; Qian, Quan[4]; Low, Jonathan Sze Choong[5]; Yune, Jeremy Heiarii Ronald[6]; Tan, Daren Zong Loong[7]; Bressan, Stéphane[8]; Sanvito, Stefano[9]; Kalidindi, Surya R.[10]
刊名	Journal of Intelligent Manufacturing
	2018
页码	1-20
ISSN号	09565515
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/2170407
专题	上海大学
作者单位	[1]Department of Mechanical Engineering, National University of Singapore, Institution of Engineers Singapore, and SPRING, Singapore, 119260, Singapore [2]Materials Genome Institute , Shanghai University , and Shanghai Materials Genome Institute, Shanghai, 200444, China [3]Materials Genome Institute , Shanghai University , and Shanghai Materials Genome Institute, Shanghai, 200444, China [4]Materials Genome Institute , Shanghai University , and Shanghai Materials Genome Institute, Shanghai, 200444, China [5]Singapore Institute of Manufacturing Technology, ASTAR, Singapore, Singapore [6]Singapore Institute of Manufacturing Technology, ASTAR, Singapore, Singapore [7]Singapore Institute of Manufacturing Technology, ASTAR, Singapore, Singapore [8]School of Computing, National University of Singapore, Singapore, Singapore [9]School of Physics, AMBER and CRANN Institute, Trinity College, Dublin 2, Ireland [10]Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA, United States
推荐引用方式 GB/T 7714	Ramakrishna, Seeram[1],Zhang, Tong-Yi[2],Lu, Wen-Cong[3],et al. Materials informatics[J]. Journal of Intelligent Manufacturing,2018:1-20.
APA	Ramakrishna, Seeram[1].,Zhang, Tong-Yi[2].,Lu, Wen-Cong[3].,Qian, Quan[4].,Low, Jonathan Sze Choong[5].,...&Kalidindi, Surya R.[10].(2018).Materials informatics.Journal of Intelligent Manufacturing,1-20.
MLA	Ramakrishna, Seeram[1],et al."Materials informatics".Journal of Intelligent Manufacturing (2018):1-20.

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